[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Modeling and Optimization of Moisture Diffusion and Integrated Thermo-Hygro-Vapor Stress for PBGA Package
Zhang, Liangzhao, Li, Ming, Gao, LimingYear:
2020
DOI:
10.1109/icept50128.2020.9202873
File:
PDF, 3.99 MB
2020