[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Effect of Dry Degumming and Wet Etching Process on Uniformity of Solder Bumps Height and Size
Zhu, Yajun, Fei, Geng, Ren, Yulong, Sun, PengYear:
2020
DOI:
10.1109/icept50128.2020.9201922
File:
PDF, 2.96 MB
2020