[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Research on Forming Mechanism and Optimization Scheme of Acid-Etched Pinhole on High-Density Packaging Substrate
He, Dongyu, Li, Pengbo, Yu, Hongkun, Lo, Kuang-Lin, Ou, Hsien-Hsun, Cheng, XiaolingYear:
2020
DOI:
10.1109/icept50128.2020.9202558
File:
PDF, 3.24 MB
2020