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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Influence of Titanium on Low Temperature Active Bonding of Quartz Glass with Bi42Sn2Ag2Ti(Ce,Ga) Alloy Filler
Chen, Dongyuan, Cheng, Lanxian, Yue, Xuejun, Li, GuoyuanYear:
2020
DOI:
10.1109/icept50128.2020.9202599
File:
PDF, 2.78 MB
2020