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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging
Lianto, Prayudi, Tan, Chin Wei, Jie Peng, Qi, Jumat, Abdul Hakim, Dai, Xundong, Peter Fung, Khai Mum, Huei See, Guan, Chong, Ser Choong, Wee David Ho, Soon, Serine Soh, Siew Boon, Huang Sharon Lim, SeYear:
2020
DOI:
10.1109/ECTC32862.2020.00181
File:
PDF, 602 KB
2020