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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Theoretical Investigation of the thermodynamic stability and Density of States in α-(Co, Cu)Sn 3

Yang, Donghua, Ran, Teng, Zhai, Xiang, Du, Fei, Song, Jingjing, Zhang, Chunhong, Huang, Fuxiang, Fan, Tao
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Year:
2020
DOI:
10.1109/icept50128.2020.9202959
File:
PDF, 3.01 MB
2020
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