A Review of Methods for the Reliability Testing of Flexible...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2020

A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics

Davila-Frias, Alex, Yadav, Om Prakash, Marinov, Val
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Year:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.3029250
File:
PDF, 485 KB
2020
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