Using Digital Image Correlation Method to Evaluate Fracture Parameters of Lead-Free Solder
Tao, Quang Bang, Benabou, Lahouari, Nguyen Van, Thien An, Nguyen Thi, Ngoc AnhVolume:
902
Journal:
Applied Mechanics and Materials
DOI:
10.4028/www.scientific.net/amm.902.86
Date:
September, 2020
File:
PDF, 570 KB
2020