The Chemical Deposition of Polypyrrole at a Copper Surface...

Materials Science Forum 2020 / 10 Vol. 1012

The Chemical Deposition of Polypyrrole at a Copper Surface Varying Concentrations of Salicylic Acid in the Reactive Medium

Liu, Andrea Santos, da Silva, Evelise Machado Ferri, Cho, Liu Yao
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Volume:
1012
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.1012.447
Date:
October, 2020
File:
PDF, 557 KB
2020
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