[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Wire Bonding and Soldering Study of Thin Ni-P ENEPIG Surface Finish
Miao, Hua, Gu, Xin, Shi, DongAnnée:
2020
DOI:
10.1109/icept50128.2020.9202982
Fichier:
PDF, 2.73 MB
2020