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Development of Ultrathin Thermal Ground Plane with Multiscale Micro/Nanostructured Wicks
Yang, Yinchuang, Liao, Dong, Wang, Hongzhao, Qu, Jian, Li, Jian, Qiu, HuiheJournal:
Case Studies in Thermal Engineering
DOI:
10.1016/j.csite.2020.100738
Date:
September, 2020
File:
PDF, 905 KB
2020