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Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)
Kim, Youjung, Jin, Sanghyun, Park, Kimoon, Lee, Jinhyun, Lim, Jae-Hong, Yoo, BongyoungVolume:
8
Journal:
Frontiers in Chemistry
DOI:
10.3389/fchem.2020.00771
Date:
October, 2020
File:
PDF, 1.25 MB
2020