Effect of Pulse Current and Pre-annealing on Thermal...

Frontiers in Chemistry 2020 / 10 Vol. 8

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)

Kim, Youjung, Jin, Sanghyun, Park, Kimoon, Lee, Jinhyun, Lim, Jae-Hong, Yoo, Bongyoung
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Volume:
8
Journal:
Frontiers in Chemistry
DOI:
10.3389/fchem.2020.00771
Date:
October, 2020
File:
PDF, 1.25 MB
2020
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