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Thermally resistant and strong remoldable triple-shape memory thermosets based on bismaleimide with transesterification
Ning, Lijian, Yuan, Li, Liang, Guozheng, Gu, AijuanVolume:
56
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-020-05469-7
Date:
February, 2021
File:
PDF, 2.00 MB
2021