Performance evaluation of noise coupling on Germanium based TSV filled material for future IC integration technique
Navaneetha, Alluri, Kishore Reddy, A., Aruna Deepthi, S., Usha Kumari, Ch., Kumar Poola, Praveen, Arunkumar Gudivada, A., Durga Prakash, Matta, Kumar Panigrahy, AsisaJournal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2020.07.631
Date:
September, 2020
File:
PDF, 558 KB
2020