![](/img/cover-not-exists.png)
[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Low Temperature Active Bonding Mechanism of Sn3.5Ag4Ti (Ce,Ga) Alloy Filler with SiC Substrates
Ma, Kaibin, Cheng, Lanxian, Li, Guoyuan, Yue, XuejunYear:
2020
DOI:
10.1109/icept50128.2020.9202870
File:
PDF, 4.02 MB
2020