Analysis of the composition of tantalum nitride in CMOS...

Surface and Interface Analysis 2020 / 12 Vol. 52; Iss. 12

Analysis of the composition of tantalum nitride in CMOS metallization trenches using parallel angle‐resolved XPS

Wehring, Bettina, Gerlich, Lukas, Kia, Alireza M., Wislicenus, Marcus, Uhlig, Benjamin
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Volume:
52
Journal:
Surface and Interface Analysis
DOI:
10.1002/sia.6887
Date:
December, 2020
File:
PDF, 8.16 MB
2020
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