Packaging reliability estimation of high-power device...

Microelectronics Reliability 2020 / 11 Vol. 114

Packaging reliability estimation of high-power device modules by utilizing silver sintering technology

Lee, Chang-Chun, Kuo, Kuo-Shu, Wang, Chi-Wei, Chang, Jing-Yao, Han, Wei-Kuo, Chang, Tao-Chih
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Volume:
114
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113890
Date:
November, 2020
File:
PDF, 670 KB
2020
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