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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Thermodynamic Analysis and Assembly Optimization of Large-Scale Solid Electrolyte Tantalum Capacitor welded on the LTCC substrate
Jin, Jiafu, Ren, Rong, Wang, ZhihaiYear:
2020
DOI:
10.1109/icept50128.2020.9202987
File:
PDF, 548 KB
2020