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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding
Joo, Hong-Sub, Lee, Choong-Jae, Min, Kyung Deuk, Hwang, Byeong-Uk, Jung, Seung-BooJournal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-020-04819-0
Date:
November, 2020
File:
PDF, 1.07 MB
2020