IMC suppression and phase stabilization of Cu/Sn-Bi/Cu...

Materials Letters 2021 / 01 Vol. 282

IMC suppression and phase stabilization of Cu/Sn-Bi/Cu microbump via Zn doping

Song, Rui-Wen, Jordon Fleshman, Collin, Wang, Yu-Ching, Tsai, Su-Yueh, Duh, Jenq-Gong
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Volume:
282
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2020.128735
Date:
January, 2021
File:
PDF, 714 KB
2021
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