Tailoring the thermoelectric and structural properties of...

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Journal of Materials Chemistry C 2020

Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM 1+x Sn 1−x S 4 (M = Ti, V, Cr, Co)]

Bourgès, Cédric, Srinivasan, Bhuvanesh, Fontaine, Bruno, Sauerschnig, Philipp, Minard, Alizée, Halet, Jean-François, Miyazaki, Yuzuru, Berthebaud, David, Mori, Takao
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Year:
2020
Journal:
Journal of Materials Chemistry C
DOI:
10.1039/D0TC04393A
File:
PDF, 7.19 MB
2020
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