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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Effect of the accumulated plastic deformation on J-integral for TSV-Cu/SiO 2 interface crack under cyclic thermal load
ZHANG, Min, QIN, Fei, DAI, Yanwei, He, Hongwen, Zheng, Jiantao, Zhang, Hao, CHEN, PeiYear:
2020
DOI:
10.1109/icept50128.2020.9202699
File:
PDF, 3.82 MB
2020