Dispersion-strengthened copper-based materials formed by high rate magnetron/plasmatron sputtering
G. Häussler, H.H. Daut, S. Schiller, U. Heisig, K. Goedicke, W. HempelVolume:
63
Year:
1979
Language:
english
Pages:
6
DOI:
10.1016/0040-6090(79)90113-5
File:
PDF, 386 KB
english, 1979