Thermal stability of copper interconnects fabricated by...

Thermal stability of copper interconnects fabricated by dry-etching process

Yasushi Igarashi, Tomomi Yamanobe, Toshio Ito
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Volume:
262
Year:
1995
Language:
english
Pages:
5
DOI:
10.1016/0040-6090(94)05801-6
File:
PDF, 428 KB
english, 1995
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