Thermal stability of on-chip copper interconnect structures

Thin Solid Films 1995 Vol. 262; Iss. 1-2

Thermal stability of on-chip copper interconnect structures

Ronald J. Gutmann, T.Paul Chow, Alain E. Kaloyeros, William A. Lanford, Shyam P. Muraka
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Volume:
262
Year:
1995
Language:
english
Pages:
10
DOI:
10.1016/0040-6090(95)05841-9
File:
PDF, 1.07 MB
english, 1995
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