Thermal catalytic mechanism for the metal ions(Cu, in, Pd...

Materials Science in Semiconductor Processing 2021 / 03 Vol. 123

Thermal catalytic mechanism for the metal ions(Cu, in, Pd and Pt) modified TiO2 on degradation of HCHO

Lan, Zijian, Yu, Yanlong, Li, Hanbo, Zhang, Lixin, Cao, Yaan
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Volume:
123
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2020.105547
Date:
March, 2021
File:
PDF, 6.34 MB
2021
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