[IEEE 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) - Tønsberg, Vestfold, Norway (2020.9.15-2020.9.18)] 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) - Grain Structure Analysis of Cu/SiO 2 Hybrid Bond Interconnects after Reliability Testing
Panchenko, Iuliana, Wambera, Laura, Mueller, Maik, Rudolph, Catharina, Hanisch, Anke, Bartusseck, Irene, Wolf, M. J.Year:
2020
DOI:
10.1109/ESTC48849.2020.9229743
File:
PDF, 5.35 MB
2020