Signal and Thermal Integrity Analysis of 3-D Stacked...

IEEE Transactions on Electron Devices 2021 / 1 Vol. 68; Iss. 1

Signal and Thermal Integrity Analysis of 3-D Stacked Resistive Random Access Memories

Fakhreddine, Zayer, Lahbacha, Khitem, Melnikov, Alexander, Belgacem, Hamdi, de Magistris, Massimiliano, Dghais, Wael, Maffucci, Antonio
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Volume:
68
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2020.3036574
Date:
January, 2021
File:
PDF, 12.45 MB
2021
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