Effect of thermal and vibrational combined ageing on QFN...

Microelectronics Reliability 2020 / 11 Vol. 114

Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability

Arabi, F., Gracia, A., Delétage, J.-Y., Frémont, H.
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Volume:
114
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113883
Date:
November, 2020
File:
PDF, 1.84 MB
2020
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