Reliable endpoint technique on Si trenching for backside...

Microelectronics Reliability 2020 / 11 Vol. 114

Reliable endpoint technique on Si trenching for backside circuit edit

Tanaka, Hideo, Tsao, Chun-Cheng
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Volume:
114
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113935
Date:
November, 2020
File:
PDF, 10.08 MB
2020
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