Study on Electromigration Effects and IMC Formation on...

Applied Sciences 2020 / 12 Vol. 10; Iss. 24

Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature

Wang, Zhao-Ying, Dang, Nhat Minh, Wang, Po-Hsun, Chen, Terry Yuan-Fang, Lin, Ming-Tzer
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Volume:
10
Journal:
Applied Sciences
DOI:
10.3390/app10248893
Date:
December, 2020
File:
PDF, 29.57 MB
2020
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