Thermomechanical fatigue lifetime evaluation of solder...

Soldering & Surface Mount Technology 2020 / 11 Vol. ahead-of-p; Iss. ahead-of-p

Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling

Zhang, Buen, Jabarullah, Noor H., Alkaim, Ayad F., Danshina, Svetlana, Krasnopevtseva, Irina V., Zheng, Yuan, Geetha, Nisith
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Volume:
ahead-of-p
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-06-2020-0028
Date:
November, 2020
File:
PDF, 1.52 MB
2020
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