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Atom beam sputtered Mo2C films as a diffusion barrier for copper metallization
C.C. Tripathi, Mukesh Kumar, Dinesh KumarVolume:
255
Year:
2009
Language:
english
Pages:
5
DOI:
10.1016/j.apsusc.2008.09.076
File:
PDF, 1.08 MB
english, 2009