Three-dimensional simulation of underfill process in flip-chip encapsulation
Hui Wang, Huamin Zhou, Yun Zhang, Dequn Li, Kai XuVolume:
44
Year:
2011
Language:
english
Pages:
15
DOI:
10.1016/j.compfluid.2010.12.030
File:
PDF, 3.97 MB
english, 2011