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Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective
Yair Ein-Eli, David StarosvetskyVolume:
52
Year:
2007
Language:
english
Pages:
14
DOI:
10.1016/j.electacta.2006.07.039
File:
PDF, 1.69 MB
english, 2007