Filling of microvia with an aspect ratio of 5 by copper...

Electrochimica Acta 2009 Vol. 54; Iss. 9

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

O. Lühn, C. Van Hoof, W. Ruythooren, J.-P. Celis
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Volume:
54
Year:
2009
Language:
english
Pages:
5
DOI:
10.1016/j.electacta.2008.04.002
File:
PDF, 787 KB
english, 2009
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