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Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum
M. Quinet, F. Lallemand, L. Ricq, J.-Y. Hihn, P. Delobelle, C. Arnould, Z. MekhalifVolume:
54
Year:
2009
Language:
english
Pages:
8
DOI:
10.1016/j.electacta.2008.09.052
File:
PDF, 2.00 MB
english, 2009