![](/img/cover-not-exists.png)
Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution
Kazuhiro Fukami, Yuki Tanaka, Mohamed L. Chourou, Tetsuo Sakka, Yukio H. OgataVolume:
54
Year:
2009
Language:
english
Pages:
6
DOI:
10.1016/j.electacta.2008.10.024
File:
PDF, 881 KB
english, 2009