Filling of mesoporous silicon with copper by...

Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution

Kazuhiro Fukami, Yuki Tanaka, Mohamed L. Chourou, Tetsuo Sakka, Yukio H. Ogata
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Volume:
54
Year:
2009
Language:
english
Pages:
6
DOI:
10.1016/j.electacta.2008.10.024
File:
PDF, 881 KB
english, 2009
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