Adhesion studies in integrated circuit interconnect...

Engineering Failure Analysis 2007 Vol. 14; Iss. 2

Adhesion studies in integrated circuit interconnect structures

J.M. Molina-Aldareguia, I. Ocaña, D. González, M.R. Elizalde, J.M. Sánchez, J.M. Martínez-Esnaola, J. Gil-Sevillano, T. Scherban, D. Pantuso, B. Sun, G. Xu, B. Miner, J. He, J. Maiz
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Volume:
14
Year:
2007
Language:
english
Pages:
6
DOI:
10.1016/j.engfailanal.2006.02.008
File:
PDF, 328 KB
english, 2007
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