Study on the thermoforming of PC films used for in-mold...

International Communications in Heat and Mass Transfer 2008 Vol. 35; Iss. 8

Study on the thermoforming of PC films used for in-mold decoration

Shia-Chung Chen, Shih-Tsun Huang, Ming-Chung Lin, Rean-Der Chien
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Volume:
35
Year:
2008
Language:
english
Pages:
7
DOI:
10.1016/j.icheatmasstransfer.2008.04.008
File:
PDF, 1.54 MB
english, 2008
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