Mechanical effect of process condition and abrasive...

Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization

Hyunseop Lee, Boumyoung Park, Haedo Jeong
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Volume:
209
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.jmatprotec.2008.04.021
File:
PDF, 978 KB
english, 2009
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