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Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization
Hyunseop Lee, Boumyoung Park, Haedo JeongVolume:
209
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.jmatprotec.2008.04.021
File:
PDF, 978 KB
english, 2009