Preparation and self-assembly of copper nanoparticles via...

Preparation and self-assembly of copper nanoparticles via discharge of copper rod electrodes in a surfactant solution: a combination of physical and chemical processes

Su-Yuan Xie, Zhi-Jie Ma, Chun-Fang Wang, Shui-Chao Lin, Zhi-Yuan Jiang, Rong-Bin Huang, Lan-Sun Zheng
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Volume:
177
Year:
2004
Language:
english
Pages:
5
DOI:
10.1016/j.jssc.2004.07.012
File:
PDF, 416 KB
english, 2004
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