An analysis of thermal residual stresses in SiCf/Cu...

An analysis of thermal residual stresses in SiCf/Cu composites when TiC or Ni as binder

Xian Luo, Yanqing Yang, Jiankang Li, Meini Yuan, Bin Huang, Yan Chen
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Volume:
29
Year:
2008
Language:
english
Pages:
7
DOI:
10.1016/j.matdes.2008.03.025
File:
PDF, 426 KB
english, 2008
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