Air-bridge interconnection and bondpad process for non-planar compound semiconductor devices
Gwenn Ulliac, Sophie Garidel, Jean-Pierre Vilcot, Pascal TilmantVolume:
81
Year:
2005
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2005.02.006
File:
PDF, 278 KB
english, 2005