Characterisation of a new hump-free device structure for...

Microelectronic Engineering 2005 Vol. 81; Iss. 1

Characterisation of a new hump-free device structure for smart power and embedded memory technologies

Stefan Schwantes, Josef Fuerthaler, Thilo Stephan, Michael Graf, Volker Dudek, Tim Barry, Gayle Miller, James Shen
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Volume:
81
Year:
2005
Language:
english
Pages:
8
DOI:
10.1016/j.mee.2005.04.007
File:
PDF, 303 KB
english, 2005
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