Novel dielectric capping layer approach for advanced copper...

Microelectronic Engineering 2006 Vol. 83; Iss. 11-12

Novel dielectric capping layer approach for advanced copper interconnects using chemical grafting

I. Bispo, B. Couturier, P.H. Haumesser, P. Mangiagalli, H. Monchoix, G. Passemard, C. Peyne, S. Roy, N. Thieriet, P. Rabinzohn, C. Bureau
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Volume:
83
Year:
2006
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2006.09.033
File:
PDF, 362 KB
english, 2006
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