Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration
B. Charlet, L. Di Cioccio, J. Dechamp, M. Zussy, T. Enot, R. Canegallo, A. Fazzi, R. Guerrieri, L. MagagniVolume:
83
Year:
2006
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2006.10.052
File:
PDF, 1.24 MB
english, 2006