Process improvement of 0.13 μm Cu/Low K (Black DiamondTM) dual damascene interconnection
H.Y. Li, Y.J. Su, C.F. Tsang, S.M. Sohan, V. Bliznetsov, L. ZhangVolume:
45
Year:
2005
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2004.11.057
File:
PDF, 1.11 MB
english, 2005