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Reliability challenges for copper low-k dielectrics and...

Reliability challenges for copper low-k dielectrics and copper diffusion barriers

Zs. Tökei, Y.-L. Li, G.P. Beyer
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Volume:
45
Year:
2005
Language:
english
Pages:
7
DOI:
10.1016/j.microrel.2005.07.040
File:
PDF, 288 KB
english, 2005
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