Three-dimensional nanometric sub-surface imaging of a...

Microelectronics Reliability 2007 Vol. 47; Iss. 9-11

Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method

E. Ramsay, K.A. Serrels, M.J. Thomson, A.J. Waddie, R.J. Warburton, M.R. Taghizadeh, D.T. Reid
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Volume:
47
Year:
2007
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2007.07.069
File:
PDF, 728 KB
english, 2007
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